
Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Jul 5 - Jul 10
For Your Every Summer RSVP, with Code: SUMMER15
Description
Thermal Paste 25 gramsBoron thermal Paste. High quality heat conductive paste for heat sinks with thermal conductivity up to 1. 05W mK. The thermal paste is designed to ensure better heat transfer between the heat source electronic component and its heat sink. It fills the unevenness between the surface of the heat sink and the surface of the cooled component and thus increases the heat transfer to the heat sink, which then has a greater cooling efficiency. By using a heat
Boron thermal Paste.
High quality heat conductive paste for heat sinks with thermal conductivity up to 1.05W/mK. The thermal paste is designed to ensure better heat transfer between the heat source - electronic component and its heat sink. It fills the unevenness between the surface of the heat sink and the surface of the cooled component and thus increases the heat transfer to the heat sink, which then has a greater cooling efficiency. By using a heat conductive paste, you will improve the overall cooling efficiency and extend the life of the cooled components. Suitable for all semiconductors (LEDs), processors, graphics cards, memory modules, 3D Printer, hearbreaks, hearters & thermistors. The paste is not electrically conductive.
Thermal conductivity: 1.05W/mK
Minimum operating temperature: -50°C
Maximum operating temperature: 200°C
25grams.
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
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Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy